Fujitsu Unveils World's First Multi-Chip Package with Burst Mode Functionality

Tokyo, June, 2, 2003 -- Fujitsu Limited today announced the development of a new memory product for next-generation mobile phones and other high-performance mobile applications, the MB84SR6H5K5K1, a multi-chip package (MCP) combining Mobile Fast Cycle RAM (FCRAM*1) and burst mode(*2) flash memory. Fujitsu is shipping samples of the new chip package starting today.

The new multi-chip package includes one 128Mbit (Mb) NOR-type flash memory and two 64Mb Mobile FCRAM chips compliant with the Common Specification for Mobile RAM (COSMORAM*3). Both memory units are capable of burst-mode operation at 66MHz, enabling high-speed data access. Moreover, the new MCP is a low-voltage device, requiring only 1.8V of power.

The product is designed especially for use in 3G mobile phones, where the burst mode operation will deliver the high-speed data transfer rates essential for sending and playback of streaming video and other multimedia functions.

Fujitsu plans to extend this line to suit diverse customer needs, adding a model with 64Mb flash memory and 32Mb Mobile FCRAM, and increasing burst frequencies to 80MHz and even 100MHz.

Features

1. Fast access times
   • Adding burst-mode capabilities to both the flash memory and Mobile FCRAM allows for faster read operations.
   • Burst-mode access times are 11ns for flash memory, 12ns for Mobile FCRAM (at 66MHz).
   • Asynchronous read/write operations also supported.
2. Low power consumption
   • Operating on 1.8V power, the flash memory requires a maximum of 10µA, the Mobile FCRAM a maximum of 120µA of standby current.
   • The Mobile FCRAM also includes a power-down mode that dramatically reduces its power requirements (max 10µA).
3. Pin layout shared by all three COSMORAM-developing companies
   • Support for the COSMORAM standard (including pin layouts) simplifies board and connector design for customers.

Main Specifications of the MB84SR6H5K5K1

Packaging 9 x 12 x 1.4 mm 115-pin FBGA COSMORAM-compliant burst-MCP pin layout Flash memory Mobile FCRAM Density 128Mb 64Mb (x 2) I/O configuration x16 x16 Operating voltage 1.65 to 1.95V 1.65 to 1.95V Operating temperature -30 to +85ºC -30 to +85ºC Burst frequency 66MHz 66MHz Burst access time (max) 11ns 12ns Address access time (max) 56ns 70ns Page access time (max) - 20ns Active current (max) 30mA 30mA Standby current (max) 10µA 120µA (per chip) Power-down current (max) - 10µA (per chip) Erase/rewrite cycles (min) 100,000 -

Glossary

*1. Mobile FCRAM (Fast Cycle RAM)

FCRAM is an advanced memory core design, proprietary to Fujitsu, with low power consumption and fast operation. Mobile FCRAM is a pseudo-SRAM technology that couples an FCRAM core to an SRAM interface.

*2. Burst mode

A special mode of operation for memory enabling fast, continuous reads synchronized to the system clock, so that a large amount of information can be read in a large block, simply by specifying one partial address. FCRAM adds the ability to perform write operations in burst mode as well.

*3. Common Specification for Mobile RAM (COSMORAM)

A specification developed jointly by Fujitsu Limited, NEC Electronics Corp. and Toshiba Corp., and announced on February 17, 2003. Refers to a standard for burst mode pseudo-SRAM chips and MCPs containing these chips.

Sample Pricing and Availability

Product name:	MB84SR6H5K5K1
Price:	15,000 yen in Japan (excl tax)
Available:	beginning June 2, 2003
Sales target:	1 million units/month

Trademark notice

• FCRAM is a registered trademark of Fujitsu Limited
• All other product names and company names mentioned herein are the trademarks or registered trademarks of their respective firms.

Press Contacts

[Customer Contact] Electronic Devices LSI Group, System Memory Division Technology & System Application Enabling Department Tel: +81-42-532-1399 (direct) E-mail: edevice@fujitsu.com

All company/product names mentioned may be trademarks or registered trademarks of their respective holders and are used for identification purpose only.
Please understand that product prices, specifications and other details are current on the day of issue of the press release, however, may change thereafter without notice.